Soldering Equipment - List of Manufacturers, Suppliers, Companies and Products

Soldering Equipment Product List

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The IH soldering device "S-WAVE" achieves zero waste soldering.

The IH soldering device "S-WAVE" achieves zero waste soldering.

Zero waste solder + CO2 reduction for environmental measures!

The IH soldering device 'S-WAVE' enables non-contact, pinpoint heating, allowing for soldering in narrow areas that cannot be addressed by manual methods. There is no concern about the surrounding solder areas re-melting, making it possible to achieve high-quality and efficient soldering even on high-density printed circuit boards. Since solder heating can be done non-contact, it achieves zero waste solder (free from residual solder on tips or in tanks). This contributes to environmental issues by reducing CO2 emissions and lowering costs (as a significant amount of CO2 is emitted during the recycling process of waste solder). <Features> ■ Energy-saving due to fewer consumables ■ Non-contact localized heating ■ Soldering possible from below ■ Low maintenance and low running costs ■ Rapid heating with high output even in hard-to-heat areas ■ High precision and high-speed soldering is achievable *For more details, please refer to the PDF materials.

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IH soldering device S-WAVE [Improving solder quality and increasing production volume]

IH soldering device S-WAVE [Improving solder quality and increasing production volume]

High-quality requirements and mass production are met with "non-contact soldering." A soldering device with non-contact and localized heating, currently under patent application. *Free sample processing available.

The IH soldering device "S-WAVE" enables non-contact and localized heating in confined spaces through heating technology. It eliminates the risk of re-melting surrounding solder areas, allowing for high-quality and efficient soldering of high-density printed circuit boards. It excels in production processes with high quality demands and is suitable for mass production. *Compatible with terminals ranging from φ0.3 to 1.5mm. ～ Documents summarizing case studies and technical information are currently available! ～ You can view them immediately from the [PDF Download] below. ＜ Common issues with soldering ＞ ◎ The running costs of adjusting or replacing consumable parts are burdensome... ◎ There are quality issues due to variability and burdens from rework processes... ◎ We want to improve yield... ◎ We want to solder in narrow areas that cannot be done manually... ◎ We want to switch from batch soldering to inline production... ◎ It is difficult to balance skill development and quality... ⇒ These concerns can be resolved with the "IH Soldering Device S-WAVE"! ★ If you would like to request sample processing or a demonstration with a demo machine, please feel free to contact us.

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[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands

[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands

Achieving OEE improvement and CT reduction in the soldering process. Minimizing upstream and downstream processes while maximizing automatic soldering time with the IH soldering device 'S-WAVE'.

The IH soldering device "S-WAVE" was born as a device that allows for soldering that is "tool exchange-free" and "fast and beautiful with high thermal capacity." This document introduces the improvement in production capacity resulting from the above two features. It provides detailed explanations on "changes in the soldering process flow with S-WAVE" and "improvements in production capacity with S-WAVE = improvements in OEE and reductions in CT." *We have summarized technical information and case studies in an easy-to-understand manner, so please take a moment to read it! [Contents] ■ Changes in the soldering process flow with S-WAVE ■ Improvements in production capacity with S-WAVE = improvements in OEE and reductions in CT ■ Preliminary examination of the introduction effects of S-WAVE ■ Competitiveness we aim for with our customers *For more details, please refer to the PDF document or feel free to contact us.

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Overcoming soldering challenges: "IH Soldering Device" [Case Study]

Overcoming soldering challenges: "IH Soldering Device" [Case Study]

Since it heats metal without contact, soldering is possible even with a "4mm" wall terminal! We also introduce examples of achieving soldering on a 6-layer thick copper substrate.

The IH soldering device "S-WAVE" has a magnetic concentration head tip that operates below 100°C, while the terminals can rise to 250°C. This allows for soldering without issues even when resin is nearby. Thanks to EV adoption, even large heat capacity substrates that have become more common in automotive components can be effectively soldered with S-WAVE, as it heats not only the terminals but also the flat patterns and solder, significantly improving solder joint quality. The "Introduction of Wall-Mounted Terminal Examples" section features common examples of automotive substrates and heating conditions. The "Introduction of Large Heat Capacity Substrate Examples" section includes examples of large heat capacity substrates and thermographic results. Additionally, we explain the benefits of the WAVE series IH soldering, making it easy to reference when considering implementation. **Benefits of IH Soldering in the S-WAVE Series** - In addition to terminals, pads and solder also generate heat, which shortens the cycle time for soldering medium to large heat capacity terminals. - Non-contact operation means there are no replacement parts. - Non-contact operation ensures stable quality. - This method minimizes the occurrence of solder balls. *For more details, please refer to the PDF materials or feel free to contact us.*

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[IH Soldering Example] Wall Terminal

[IH Soldering Example] Wall Terminal

Introducing a case where soldering was made possible even with a distance of 4mm between the resin case and the terminal!

We would like to introduce a case of IH soldering performed on the edge terminals of automotive products. When the resin part is close to the terminals, the soldering iron method can cause issues with radiant heat, and the laser method can have problems with reflected light, often resulting in the melting of the resin part. In the case of the IH method, the magnetic concentration head tip has the characteristic of raising the terminal temperature to 250°C while remaining below 100°C for the surrounding resin, allowing for soldering without any issues even when resin is nearby. [Case Summary] ■ Issues - The soldering iron method can cause problems with radiant heat, and the laser method can have issues with reflected light, often melting the resin part. ■ Results - In the case of the IH method, soldering can be performed without issues even when resin is nearby. *For more details, please refer to the PDF document or feel free to contact us.

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